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The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network (FCN) has ...
In this work, a probabilistic imaging algorithm based on ellipse method was carried out to locate a fatigue crack using nonlinear S0 mode Lamb waves, which was modeled by Three-dimensional (3D) Finite ...
As hydrogen becomes an increasingly important part of global decarbonisation strategies, the infrastructure required to ...
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