Everything starts with the design. Engineers review every PCB file carefully, checking trace widths, spacings, and hole sizes ...

Solder paste printing position offset is a common type of defective printed circuit boards (PCBs) printing, and accurate position offset prediction helps to avoid the production of defects, thus ...

This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...