Northrop Grumman manufactures millions of the chips in America each year, FOX Business correspondent Max Gorden reported ...

The public-private joint venture will have to overcome three hurdles to realize the country’s long-abandoned dream.

Lasers that are fabricated directly onto silicon photonic chips offer several advantages over external laser sources, such as ...

The Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a ...

Researchers at the University of Strathclyde have developed a new method for assembling ultra-small, light-controlling ...

Samsung Foundry to mass produce its bleeding-edge 1.4nm process node in 2029, a full two years later than its planned 2027 timeline.

Arteris, Inc. launches Magillem Packaging software to enhance semiconductor design efficiency by automating IP packaging and integration.

Keysight Technologies and Synopsys introduce AI-powered RF design migration flow for TSMC's N6RF+ to N4P technology, addressing the performance requirements of wireless integrated circuit ...

AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high-performance power management solutions.

Intel and Taiwan Semiconductor are collaborating on 2nm product for Intel's next-gen processors. AMD is also a client. Taiwan Semiconductor denies any partnership rumors.

Intel plans to build its upcoming Nova Lake CPUs on TSMC's forthcoming 2nm semiconductor process node, according to Economic Daily News. If accurate, next year's desktop PCs ...

Explore Honsu Group, Taiwan's leading developer of semiconductor wet process equipment. Learn how they're scaling capacity, driving innovation, and preparing for US expansion.