Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the through-silicon vias (TSVs) defect tend to be clustered, reducing the yield of 3-D integrated circuit ...

Subscribe Today » Phil Thompson, an architecture illustrator who launched his illustration career in Chicago, moved to Lancaster city in August of 2024. Edison Vuong ...

We present a novel and practical deep fully convolutional neural network architecture for semantic pixel-wise segmentation termed SegNet. This core trainable segmentation engine consists of an encoder ...