Over the past years, computer scientists have introduced increasingly sophisticated generative AI models that can produce ...

In this paper, high density TSV integration in silicon interposer is presented, fully characterized and simulated (DC and RF). Parasitic elements of the RF model are extracted. Dielectric and metal ...

In biology textbooks and beyond, the human genome and DNA therein typically are taught in only one dimension. While it can be ...

° A physical vapor deposition (PVD) formed WNi thinfilm over M1 (metal level 1) after its revealing in the via-last through-Si-via (TSV) process has been investigated for its ability in protecting the ...

A Loughborough University student has developed a new medical device that could transform how prostate health is assessed and ...