In an era where smartphones are expected to be all-rounders, cameras, powerhouses, and fashion accessories, vivo’s X200 FE ...

A plethora of passives and packaging technologies and elevated electric aviation share the spotlight with yet another debate ...

China added 212.2 GW of new solar capacity in the first half of 2025, pushing total installed PV capacity past 1.1 TW, according to the National Energy Administration (NEA).

While aimed at AI accelerators, new 3GB GDDR7 chips could help deliver 18GB and 24GB VRAM GPUs more efficiently ...

Limiting inverter output, called derating, enables installers to maintain system power rating when adding a new inverter to an existing solar installation, or to help homeowners qualify for incentives ...

The Global Market for Automotive IDM was valued at USD 6663 Million in the year 2024 and is projected to reach a revised size of USD 14450 Million by 2031, growing at a CAGR of 11.9% during the ...

Stackpole’s rugged RPCQ form-factor chip resistors withstand extreme power pulse levels in automotive applications.

New Electronics talks to Virtium Embedded Artists, a newly merged company and discusses their future SOM plans.

Researchers at King Abdullah University of Science and Technology (KAUST) have unveiled a data‑driven method for picking the ...

Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional wire-bonding ...