Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising solution ...

If you're looking to take the plunge into the world of ESP32 devices, then here's a basic overview of what you need to know.

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This paper presents the design, fabrication, and characterization of a module-level spring-interconnected stack power module for power semiconductor devices. The benefit of multilayer design ...