Low temperature copper-copper direct bonding at ambient air on plain and patterned surfaces was developed at CEA LETI. In this paper we will review this bonding in terms of simulation models, process ...

This study selected nanosilver metal particle fillers with a modified layer residual rate of <0.4 wt%. Research has found that the glycidyl ester resin structure can produce coordination relationships ...

Forget Plastic, ASUS RTX 5090 BTF Metal Connector Survives 1900W Torture Test by Zak Killian — Tuesday, June 24, 2025, 05:00 PM EDT Comments ...

Discover how plastic packaging contaminates food with microplastics, posing health risks. Learn steps to reduce exposure and advocate for systemic change.