This research has focused on the packaging process of tapioca powder and aims to offer guidance for improvements using simulation modeling approach to analyze problems and designing a better process.

However, during the packaging process, there are various possible failure modes that may affect the switch yield and performance. The RF MEMS switches were first placed in a package and went through ...

Nigerians should never willingly don the filthy garb of corruption to please anybody. We are normal people who will improve over time with the help of some honesty, technology, and discipline.

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump ...

Explore the fascinating process behind mass-producing wooden furniture with a detailed look at how wood couches are manufactured in a large-scale factory setting. This video takes you behind the ...

A simplistic understanding of flip-chip technology is illustrated as a four-step process in Figure 1. Each of these steps is as follows: Figure 1. The four-step process of flip-chip technology in IC ...

The in situ hydrogen plasma process from Dr. Hicks and Surfx Technologies gives a no-residue way to remove oxides in semiconductor packaging. As chip designs become smaller and more connected for uses ...