The applications have, in turn, motivated a progression from traditional helical to recent miniaturized printed circuit board implementation, in order to improve the overall power density.

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

A Design-for-test (DfT) technique is proposed in this paper for a test method, by which detecting open defects occurring interconnects between 3D stacked SRAM IC and a printed circuit board and among ...