We have developed a hybrid bonding process that uses low-temperature curable polyimide to bond silicon chips with minimal damage. We designed a low elasticity photosensitive polyimide and a low-CTE ...

The goals of this Perspective are threefold: (1) to inform a broad audience, including machine learning (ML) and artificial intelligence (AI) academics and professionals, about synthetic drug ...

Today, a competitive manufacturing environment imposes further production cost reduction on modern companies. Seeking proper recommendations in production and maintenance planning are the two ...

In today’s tech-dominant environment, high-performance engineering teams are crucial to building the next generation sol ...