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Kwak, Hyunsoo & Ryu, Sungyoon & Cho, Suil & Kim, Junmo & Yang, Yusin & Kim, Jungwon. (2021). Non-destructive thickness characterisation of 3D multilayer semiconductor devices using optical spectral ...
Multi-layer 3-dimensional (3D) vertical RRAM (VRRAM) PUF with in-cell stabilization scheme to improve both cost efficiency and reliability. The proposed PUF features excellent resistance against ...
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