Now, a team of researchers led by Professor Huang Xian from the School of Precision Instrument and Opto-electronics ...

A research team at Pohang University of Science and Technology (POSTECH), has developed a novel dry adhesive technology that ...

Conventional testing approaches face major limitations, with some methods damaging wafer surfaces irreversibly, while others ...

Using this technology, the research team successfully attached micro LED chips to a display substrate with precision using robots and demonstrated stable handling of materials like paper and fabric.

Tianjin University scientists have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a ...

The testing method checks micro-LED wafers without damage. It uses soft probes and tools to improve yield, lower costs, and ...

The National Science and Technology Council (NSTC) approved on July 2, 2025, six investment projects across various science ...

Researchers at POSTECH have developed a dry adhesive using shape memory polymers that enables precise pick-and-place of micro-LEDs and everyday materials—without glue or residue, this could transform ...

TIANJIN, June 15 (Xinhua) -- Chinese researchers have achieved a breakthrough in micro-LED wafer testing by developing a non-destructive detection method, thereby addressing a longstanding challenge ...

The company emphasized strong growth momentum for 2025, driven by Micro LED display technology and the rising demand for advanced semiconductor packaging solutions.