The TLP579xH series is housed in a small SO6L package, contributing to improved flexibility in component placement on the PCB. Also, the new products feature a minimum creepage distance of 8mm and an ...

Infineon has launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were ...

For example, thermal cycling from –20° to 120°C is common for evaluating electronic components. In AME, devices such as interposers, antennas or embedded connectors may pass without issue, while ...

DEAL Semi’s innovative asymmetrical MOSFET architecture offers performance for 150- to 200-V apps that rivals SiC and GaN at ...

Every aspect of data center energy use must be optimized to reduce power consumption and enable more sustainability, from ...

The MOSbius chip [top left] contains all the transistors required for many analog systems. Mounted on a breadboard via a ...

SOP Advance(E) package enables lower loss and higher efficiency for industrial equipment, data centres, and base stations ...

Toshiba Electronics Europe GmbH has launched two new N-channel power MOSFETs, the 80V TPM1R908QM and the 150V TPM7R10CQ5. These latest offerings adopt the company's innovative SOP Advance (E) package, ...

A low-power active gate driver (AGD) design becomes critical in battery-based power conversion systems (DCDC converters) to extend battery life. This paper proposes an integrated active gate driver ...

A simple circuit can prevent hours of rework caused by momentary lapses of concentration when an incorrect power supply is ...

It’s a simple oscillator circuit tailored to create a magnetic field around a water pipe to perform water conditioning.

The progress of wireless communication systems is highly dependent on microwave technologies. With the escalating adoption of higher frequency bands in communication systems and the exponential growth ...