The TLP579xH series is housed in a small SO6L package, contributing to improved flexibility in component placement on the PCB. Also, the new products feature a minimum creepage distance of 8mm and an ...

Infineon has launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were ...

For example, thermal cycling from –20° to 120°C is common for evaluating electronic components. In AME, devices such as interposers, antennas or embedded connectors may pass without issue, while ...

DEAL Semi’s innovative asymmetrical MOSFET architecture offers performance for 150- to 200-V apps that rivals SiC and GaN at ...