A 11.56-kbit one-time programmable secure array featuring Intel’s first high-volume manufacturing (HVM) ready anti-fuse memory using the 22FFL process technology is reported. First, design and process ...

This article aims to characterize the warpage evolution of fan-out wafer-level packaging (FOWLP) during the wafer-level mold cure process. A finite-element analysis (FEA)-based process modeling ...