Compact design: The MM5620’s small-footprint and low-profile 8.2 mm x 8.2 mm x 1.6mm LGA package provides a 90 percent reduction in size over conventional electromagnetic relay (EMR) solutions.

The CSD18541F5 expands TI's NexFET™ technology portfolio of FemtoFET MOSFETs to include higher voltages and manufacturing-friendly footprints. Download the design summary with more information on the ...

The LGA package is now available for all RTAX-S devices offered in ceramic column grid array (CCGA) packaging, including RTAX1000S and RTAX2000S devices. For further information about Actel's advanced ...

Socket also features an IC guide for precise LGA edge alignment. The specific configuration of the package to be tested in the CBT-LGA-5019 is LGA, 33x33mm body size, 32x32 array and 1mm pitch.

A 1-to-1 ratio between the package pad and the pc-board pad for the LGA package is recommended, although ratios down to 0.90 are acceptable.

This is a 45% footprint and 21% thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mCube MC3635 LGA package and a 64% footprint reduction compared to the present 2mmx2mm LGA package.

Telit Wireless Solutions, Inc., an internationally leading specialist in machine-to-machine (M2M) technology, launches HE910, the worldwide smallest module featuring 5-band HSPA+. The module can thus ...