With higher efficiency and lower costs, perovskite–silicon tandem cells mark a breakthrough in solar tech. Can they truly ...

Wire bonding process is widely used in packaging manufacturing to connect integrated circuits and leadframes/substrates. In the process of encapsulation by epoxy molding compound, wires are swept by ...

Siemens has launched advanced AI agents that assist industry players to work seamlessly across its Industrial Copilot ...

No, a SWOT analysis and a gap analysis are two different methods. A SWOT analysis is used to identify strengths, weaknesses, opportunities, and threats in a given situation. A gap analysis is used to ...

Based on the application, the HA Series high-accuracy turbine flow meters were recommended based on their performance with low-viscosity fluids like water and water-based solutions, high repeatability ...

BTCS aims to address margin pressure through continued scaling of operations, focusing on enhancing its technology stack, increasing order flow, and controlling block space. 3rd party Ad.

Many challenges exist in lateral flow assay (LFA) manufacturing, from low-volume liquid deposition to device assembly and packaging. In the development and batch-level manufacturing stage, antibody ...

(Alliance News) - Tekmar Group PLC on Thursday said it expects second half order intake to be strong after a sluggish first half which saw the firm report a widened loss and lower sales. The ...

As new regulations emerge and standards continue to evolve, PLM software will be more than just a system — it will be a ...

LONDON (Reuters) -Euro zone manufacturing activity showed further signs of recovery in June as new orders stopped falling for ...