“Advanced packaging today employs multi-scale thermal management techniques to efficiently spread and remove heat,” said Gerard John, senior director of the Chiplets and Flip Chip Ball Grid Array ...

Nexperia has developed a packaging technology it calls flip-chip land grid array (FC-LGA) for ESD diodes with side-wettable flank.

According to The Elec, the Galaxy Z Flip 7 will be equipped with a Samsung Exynos 2500 chip. Historically, every Galaxy Z Flip model has utilized a Qualcomm Snapdragon chipset.

Study the methods to prevent the solder resist material of flip-chip ball grid arrays crack. Strategies of releasing the stored stress in substrate to improvement SR crack were demonstrated through ...

In addition, it was found that a strain gauge placed on the substrate corner can be a very useful experimental tool in flip-chip ball grid array (FCBGA) component testing for the purpose of ...

Samsung Electro-Mechanics Co. had developed an advanced driver assistance systems (ADAS)-applicable flip chip ball grid array (FCBGA), a substrate for high-performance self-driving systems.

This includes two-times the board-level reliability of a standard FC-PBGA (Flip Chip plastic ball grid array) or FC ceramic BGA, as well as full signal wiring on both sides of the core, according to ...