With the fast growth in semiconductor industry, packaging solutions of processor units and application specific integrated circuit (ASIC) devices to meet the needs of advanced Silicon (Si) nodes, ...

In the most advanced automotive applications, where high frequency signals, design density, high pin-count, miniaturization and integration dominate the scene, the use of Ball Grid Array (BGA) package ...

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...