Article citations More>> Miller, B.A., Shipley, R.J., Parrington, R.J. and Dennies, D.P. (1995) Metals Handbook. Failure Analysis and Prevention. Fatigue Failure. Vol. 11. ASM Int Metals Park. has ...

Fatigue failure is a failure mechanism which results from the formation and growth of cracks under repeated cyclic stress loading, leading to fracture. It can result in failure at stress levels ...

During the entire service life of portable electronic products such as cellular phone, game station, and PDA, the printed circuit board (PCB) is subjected to a low frequency random vibration as a ...

Recent electromigration (EM) testing of wafer-level chip scale packages (WCSPs) under various duty factors (DFs) or pulse "on"/"off" ratio, of low-frequency pulsed-direct current (pulsed-DC) ...

“Every incident in this industry is an immediate reminder of what can go wrong,” a sobering quote shared by Airbus CEO Guillaume Faury in the wake of the recent Air India Boeing 787 crash ...