The GS66508P is packaged is an innovative embedded die package developed by AT&S (ECP® process). This ... - GaNpx Packaging Process Flow 6. Cost Analysis - Main steps of economic analysis ...

AT&S’ advanced ECP technology for microelectronic component packaging leverages embedded bare die and discrete passives into the core of a PCB, reducing the package form factor by 30-50% for ...

The team aims to provide a more efficient and responsive system for part replacements, particularly for non-critical components that previously faced delays due to the lengthy ECP process.