This paper deals with EMC testing studies conducted on Sensor devices - accelerometer/inertial sensors. Immunity and Emission performances are carried out to ensure the compliance with market needs.

We investigated a chip-package-PCB co-simulation method for power integrity design at the early design stage. Due to the number of design parameters that need to be surveyed to optimize power ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...

There was a lot of talk about AI at this year's DAC but one of the most significant was that Siemens Digital Industries ...