Researchers at the University of California, Riverside, have uncovered how to manipulate electrical flow through crystalline ...

Wire bonding process is widely used in packaging manufacturing to connect integrated circuits and leadframes/substrates. In the process of encapsulation by epoxy molding compound, wires are swept by ...

Four-Wheel Independent Steer-by-Wire (4WI-SbW) systems provide higher mobility, faster response, and more flexible layout for intelligent vehicle chassis. Thus, it is considered the future of the ...