Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology, among ...

Adhesive design also needs to consider residue cleaning requirements. “Depending on what the 2D material is, there can be smaller residues that remain like a blanket over the 2D material,” Prenger ...

A new semiconductor startup, CDimension, has officially emerged from stealth with an ambitious goal: to reconstruct the foundation of computing hardware by starting at the materials level. As AI, ...

Kim’s team did both, building a 3D chip out of vertically stacked 2D semiconductors. Coming in hot. Graphene, a single-atom-thin sheet of carbon, is probably the most famous 2D material, ...

The scientists said that the new transistor could be integrated into chips that could one day perform up to 40% faster than the best existing silicon processors made by U.S. companies like Intel.

While 3D heterogeneous integration is a revolutionary step forward for chip design, ... in 2.5D and 3D packages since they squeeze in more silicon than a traditional chip in the same 2D area.

The mechanical strength and toughness of engineering materials are often mutually exclusive, posing challenges for material ...

If Ubitium’s chips are not driving the performance of millions of systems and devices within five years or so, CEO Hyun Shin Cho will be a disappointed man. Cho, who founded Ubitium, jointly ...

Saudi Arabia’s Chip Design Ambitions Take Shape With New Hub. Kingdom wants to draw 50 companies to the country by 2030; Not trying to challenge Nvidia or Intel, head of new hub says ...