AMD means that quite literally, as its second-generation 3D V-Cache technology sees the extra cache die bonded to the bottom-side of the package, giving the CPU cores direct access to cooling.

Without the slightest fanfare, AMD has added a new "X3D" model with 3D V-Cache to its CPU lineup. Give it up, ladies and germs, for the new Ryzen 5 5500X3D (thanks to X user MEGAsizeGPU for ...

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

AMD has confirmed the existence of several upcoming processors, including a new entry-level Ryzen 5 9600X3D desktop CPU featuring its popular gaming-optimized 3D V-Cache technology.

Seagate has introduced a new 4 TB Storage Expansion Card for Xbox Series X and Series S consoles, aimed at addressing the increasing storage needs of gamers. With modern game sizes often ...

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Describe the issue Inconsistent outputs from a QDQ ONNX model when running it with the CPU EP. The outputs differ depending on whether graph optimizations are enabled or disabled. When all ...

The growth of 3D technology had led to opportunities for stacked multiprocessor-accelerator computing platforms with high-bandwidth and low-latency TSV connections between them, resulting in high ...

In order to keep reducing the bit cost, NAND Flash memory vendors have changed the NAND Flash technology from 2D to 3D since 2014. Moreover, 3D NAND Flash is becoming the mainstream of the NAND Flash ...

We introduce Articulation-XL2.0, a large-scale dataset featuring over 48K 3D models with high-quality articulation annotations, filtered from Objaverse-XL. Compared to version 1.0, Articulation-XL2.0 ...

Optimising carbon capture: EPC and BOO models for HISORP CC, oxyfuel with CPU, and amine processes, Jan Bangert, Linde Engineering. Presentation given at the 2nd Global CemCCUS Conference 2025 that ...