Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry's EMIB technology used for creating multi-die 3D integrated circuit (3D-IC) systems.

Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry's EMIB technology used for creating multi-die 3D integrated circuit (3D-IC) systems.

This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs. “Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and improves ...

"Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and improves chip reliability for the most demanding applications," said John Lee, vice president and ...

We will give you an overview of the modeling workflow in the COMSOL Multiphysics® software and demonstrate how to create models and simulation apps. Speakers Zhang Xing Li COMSOL, Inc. Sponsored by: ...

Predicting the real-world performance of capacitive devices, including touchscreens and other sensors, requires accounting for complex physics interactions — such as coupled electromagn ...

The release of COMSOL Multiphysics® version 6.3 also introduces the Electric Discharge Module, which offers powerful simulation capabilities spanning a wide range of electric discharge scenarios, ...

The release of COMSOL Multiphysics version 6.3 also introduces the Electric Discharge Module, which offers powerful simulation capabilities spanning a wide range of electric discharge scenarios, ...

The latest version of the multiphysics simulation software introduces the Electric Discharge Module, GPU-accelerated simulations, and updates for greater modeling productivity BURLINGTON, Mass., Nov.

The latest version of the multiphysics simulation software introduces the Electric Discharge Module, GPU-accelerated simulations, and updates for greater modeling productivityBURLINGTON, Mass ...

What you’ll learn: Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials ...