What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

The sensor uses a spray-coated layer of quantum dots deposited directly onto standard CMOS chips. This direct-conversion design eliminates the need for bulky scintillators, complex hybrid bonding, or ...

Teledyne e2v launches the Lince5M NIR, a high-speed CMOS image sensor for diverse industrial and medical applications.

A high performance and low cost 2.2μm 1-layer pixel near infrared (NIR) global shutter (G/S) CMOS image sensor (CIS) was demonstrated for extended reality (XR) devices and automotive applications. In ...

CMOS sensors, in comparison, can offer better band gap tuning and thus finer frequency resolution, because of the ability to use different semiconductor materials.

The OV0TA1B is designed for AI-based human presence detection (HPD), facial authentication, and always-on (AON) technology.

OmniVision Technologies has unveiled its latest intelligent CMOS image sensor, the OV01D1R, which integrates multiple functionalities into a single sensor module. This device is designed to perform ...

CEA-Leti claims ‘breakthrough’ for 3-layer integration in AI-embedded image sensors 03 Jun 2024 IEEE Denver conference hears of feasibility of combining hybrid bonding and high-density through-silicon ...

DENVER – May 31, 2024 – CEA-Leti scientists have reported three projects at ECTC 2024 that they say are steps to enabling CMOS image sensors (CIS) that - Read more from Inside HPC & AI News.

The Emerald Gen2 is the newest addition to Teledyne’s CMOS image sensor family. Emerald Gen2 is available in 8.9-megapixels or 12-megapixels, in monochrome or color, and in two-speed grades, standard ...