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Baya Systems emerged from stealth mode less than a year ago. The company announced it had raised more than $36 million in a ...
Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.
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Tech Xplore on MSN3D chip stacking method created to overcome traditional semiconductor limitationsA novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
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