Analog and mixed signal content is adding risk to ASIC designs. Pessimists see the problem getting worse, while optimists point to AI and chiplets for relief.

Explore how Sparc3D transforms 2D images into detailed 3D models with AI-powered efficiency and precision. Discover more.

Cai, W. (2025) The Philosophical Basis for the Evolution of the Doctrine of Assumption of Risk in Anglo-American Law: A ...

Two German physicists have unveiled a compact magnet layout that outperforms the famed Halbach array, delivering stronger, ...

Researchers from the HUN-REN Center for Ecological Research have developed a novel three-dimensional modeling method that ...

Siemens Digital Industries Software have introduced two new solutions to its Electronic Design Automation (EDA) portfolio ...

3D-VLA is a framework that connects vision-language-action (VLA) models to the 3D physical world. Unlike traditional 2D models, 3D-VLA integrates 3D perception, reasoning, and action through a ...

It's not very often that we are invited to media camps that require only a short flight and no passport. But when Garmin ...

A new diffractive network design enables real-time 3D and multispectral imaging without digital reconstruction or moving ...

Corrections to “Mathematical Modeling and Optimization for the Power Density of the Free-Standing Magnetic Field Energy Harvester” Abstract: The affiliation for author “Dan Zhou” in the paper [1] was ...