This video showcases a high-efficiency 60W flyback converter from Power Integrations, delivering two independent outputs—5V and 24V—using the InnoMux2-EP IC.

Power Integrations has announced the appointment of Jennifer A. Lloyd, PhD, as the company’s next chief executive officer, succeeding Balu Balakrishnan, who has held the CEO position since 2002. Dr.

Due to the high energy density of hydrogen, fuel cells allow longer flights with heavier payloads than battery technology.

Efficient Power Conversion Corporation (EPC) has unveiled the EPC91118, marking the industry’s first commercially available reference design that incorporates gallium nitride (GaN) integrated circuit ...

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Power GaN, Modernized Rectification, and Giuseppe Crippa’s Tribute! Also, check News Archives – Power ...

In modern AI data centers and Edge computing environments, high power densities and integration levels are mandatory requirements. To meet the demand for efficient power management solutions, ...

Dr. Milan Rosina, principal analyst for Power Electronics and Batteries at Yole Développement (Yole), said that EV charging requires much higher voltage, power, and amount of energy transferred.

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Power GaN, Modernized Rectification, and Giuseppe Crippa’s Tribute!

Achieving sustainability in semiconductor manufacturing paves the way for an eco-friendlier technology sector.

The heart of electric vehicles is an electric motor that supplies mechanical power and torque to the wheels. As for any other component in an EV, weight, efficiency and compactness of the motor are ...

Electric motors are the beating heart of sustainable mobility. They play a fundamental role in transforming the automotive industry and beyond. With the increasing adoption of EVs and a growing focus ...

The easy-to-use thermal calculator tool from EPC provides quick estimates for the thermal performance of PCB-mounted GaN devices.