Source: IEEE ECTC [1] TSMC’s assembly flow applies a protective layer to cover the copper pillar arrays on the SoCs’ backsides ... devices with a backside power delivery network. Source: IEEE ECTC [3] ...

A new study introduces a diffractive optical framework for real-time 3D and multispectral imaging, eliminating digital ...

A research team has synthesized three-dimensionally shaped molecules containing an internal twist and shown that they possess ...

Traditional military training often relies on standardized methods, which has limited the provision of optimized training ...

Mimicking the incredible skill of mother nature is never easy, especially when trying to match the remarkable chemical ...

Although Tissium first demonstrated its polymer material as a cardiovascular sealant, the application that the FDA just ...

Through a novel electrospinning technique, researchers have effectively achieved a “bridge” between carbon fiber and its ...

US company Peak Nano has engineered thin films of layered polymers to enhance the performance and extend the lifetime of high-voltage capacitors for critical electrical infrastructure ...

A novel three-dimensional water network containing both coordinated and lattice water molecules was obtained in the compound [Co2(BPTC)(H2O)6]n·11nH2O (1). The water network was formed by the ...

The PEDOT-NA arrays on PEDOT/textile showed outstanding performance with an areal capacitance of 563.3 mF·cm –2 at 0.4 mA·cm –2 and extraordinary mechanical flexibility. The maximum volumetric power ...