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Additionally, the monitoring of bond wire fatigue and junction temperature of IGBT modules was achieved based on the K factor parameter and the auxiliary emitter-emitter voltage spike. This provides a ...
In response to the global surge in industrial automation and smart manufacturing, precision data acquisition has become a ...
Using the electro-thermal model, the experimental results validate the efficacy of the proposed method in determining the deterioration level of the semiconductor power module. The proposed condition ...
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