To realize fine pitch pattering on printed circuit board, high productivity sputtering system for seed layer deposition is required. Roughened surface is necessary to get high adhesion by electroless ...

Engineers also demonstrated that the material remains highly conductive and can recover its electrical function after being ...

The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial ...