Besi's revenue fell 6.1% quarter-on-quarter to 144.1 million euros, weighed down by muted shipments for mobile and automotive applications.

Besi is the market leader in advanced packaging equipment, including flip chip, thermocompression bonding, or TCB, and its most advanced technology, hybrid bonding.

Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI) , the U.S.-based computer chip equipment supplier said on Monday.

Applied Materials takes 9% stake in Besi to advance hybrid bonding for energy-efficient chip packaging. New system co-developed with Besi aims to scale hybrid bonding for high-volume semiconductor ...

Applied Materials has bought a 9 per cent stake in BE Semiconductor industries (BESI), the U.S.-based computer chip equipment supplier said on Monday.The transaction makes it the largest ...