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Researchers from the Institute of Modern Physics (IMP) of the Chinese Academy of Sciences (CAS), together with collaborators ...
Gao Peng's research group at the International Center for Quantum Materials, School of Physics, Peking University, has ...
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Tech Xplore on MSN3D chip stacking method created to overcome traditional semiconductor limitationsA novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
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