Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

In this paper, we report a numerical study of a new HTS switch design made of series-connected YBCO stacks. This study aims to obtain insights into the characteristics of dynamic resistance and power ...

This week, at the 2025 IEEE International Interconnect Technology Conference (IITC), imec presents Ru lines at 16nm pitch ...

Click the button below to sign up for updates on the Regatta Series races and news.