In this paper, high density TSV integration in silicon interposer is presented, fully characterized and simulated (DC and RF). Parasitic elements of the RF model are extracted. Dielectric and metal ...

In biology textbooks and beyond, the human genome and DNA therein typically are taught in only one dimension. While it can be ...

Three-dimensional (3D) cancer models have emerged as pivotal tools in oncology research, offering a more accurate representation of tumor biology compared ...

A team has made a major breakthrough in the field of three-dimensional (3D) imaging of large-scale biological tissues. They ...

° A physical vapor deposition (PVD) formed WNi thinfilm over M1 (metal level 1) after its revealing in the via-last through-Si-via (TSV) process has been investigated for its ability in protecting the ...

A Loughborough University student has developed a new medical device that could transform how prostate health is assessed and ...