Cu pillar technology can cater for high I/O, fine pitch, and miniaturization requirements compared with wire bonding and conventional solder flip-chip technologies. However, chip-package interaction ...

For reuse, the formal description of reusable interaction is studied. Then the paper puts forward the mapping algorithm of UML Sequence Diagrams to Object Petri Nets, which ensures the accuracy, ...

This package lets you generate entity relation diagrams by inspecting the relationships defined in your model files. It is highly customizable. Behind the scenes, it uses GraphViz to generate the ...