Endogenous intracellular allosteric modulators of GPCRs remain largely unexplored, with limited binding and phenotype data available. This gap arises from the lack of robust computational methods for ...

Finally, a comprehensive sign-off analysis of chip-package interaction stresses must be performed to validate that circuit performance remains within acceptable tolerances, ensuring the reliability of ...

The unfolded protein response (UPR) is a crucial signaling network that preserves endoplasmic reticulum (ER) homeostasis, impacting both health and disease. When ER stress occurs, often due to an ...

Given the proximity of devices in HI designs, there’s a high likelihood of some type of chip-to-chip or chip-to-package interaction. Therefore, thermal coupling can be a big concern. This intensive ...

However, as new packaging technologies are introduced, the complexity of chip-package interaction is going up significantly and it is increasingly difficult for foundries and their partners to be able ...

Abstract: In this work Finite Element Modeling (FEM) is used to investigate the stress and deformation induced by chip package interaction on a 3D interposer package. A Design Of Experiments (DOE) was ...

We introduce MADna, a sequence-dependent coarse-grained model of double-stranded ... without the need to introduce additional custom packages. The repository also contains a molecular builder which ...

These authors later developed an “interaction sequence kernel association test” (iSKAT ... and both approaches can be implemented using the “iSKAT” R package. Chen et al. proposed a G × E test that ...

Crucially, this analysis also provides sequence specific details of the interaction between urea and the protein backbone. The pattern of urea-binding along the amino-acid sequence reveals a higher ...

The osbng R package provides a programmatic interface to the BNG, supporting efficient grid-based indexing and spatial analysis. This enables applications such as statistical aggregation, data ...