Utilising Infineon's improved .XT die attach interconnection technology, the G2 devices achieve more than 15 percent lower thermal resistance and an 11 percent reduction in MOSFET temperature compared ...

The company is expanding its “GaN ecosystem” with a new family of 650-V GaN power FETs, which feature a silicon-compatible ...

The MOSbius chip [top left] contains all the transistors required for many analog systems. Mounted on a breadboard via a ...

The TLP579xH series is housed in a small SO6L package, contributing to improved flexibility in component placement on the PCB ...