After six years on sale, America’s mid-engine masterpiece sees significant changes for 2026. Although the C8 Corvette’s ...

Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising solution ...

Samsung's new Galaxy Z Fold 7, Z Flip 7, and Z Flip 7 FE have sharper cameras, more powerful multitasking software, and ...

In this paper, a low parasitic inductance SiC power module with double-sided cooling is designed and compared with a baseline double-sided cooled module. With the unique 3D layout utilizing vertical ...

If you're looking to take the plunge into the world of ESP32 devices, then here's a basic overview of what you need to know.

In response to the global surge in industrial automation and smart manufacturing, precision data acquisition has become a ...