Intel will stop using lead in its upcoming microprocessors, eliminating one of the most toxic components used in semiconductors from its product line. Starting with the Penryn line of processors ...

Flip chip middle power LED package (LM131A) and high power LED package (LH141A) Samsung’s LM131A and LH141A flip chip packages feature exceptionally compact form factors of 1.22x1.22 millimeters ...

“Patterning on advanced packaging substrates, especially for different nodes with different interconnectivity needs can lead to mechanical issues and warpage,” adds Cheung. “The chip-package interface ...

In heterogeneous 3D IC architectures, the interaction between the chips and packages can compromise device functionality if not properly validated. Research has shown these thermo-mechanical stress ...