The LGA package is now available for all RTAX-S devices offered in ceramic column grid array (CCGA) packaging, including RTAX1000S and RTAX2000S devices. For further information about Actel's advanced ...

Provenance Gold Corp. is pleased to announce a significant expansion of the land package at the Eldorado project in eastern Oregon through a combination of staking and an option agreement that ...

Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is ...

Nexperia has introduced a new range of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes housed in advanced flip-chip land-grid-array (FC-LGA) packaging. This ...

Panasonic PAN B511-1C Bluetooth 6.0 and 802.15.4 module features castellated holes and LGA footprint Panasonic industry has recently introduced the PAN B511-1C Bluetooth 6.0 and 802.15.4 module based ...

These transistors offer a footprint that, for the first time, allows for easy multi-sourcing strategies and complementary layouts to Silicon-based designs. The new packages, in combination with GaN, ...

WüRTH ELEKTRONIK MagI³C-VDLM power modules in the LGA-12EP package for the 24V industrial power bus are characterized by high resilience to voltage transients on the 24V bus and an extremely wide ...

Compact design: The MM5622’s small-footprint and low-profile 8.2 mm x 8.2 mm x 1.6mm LGA package provides a 90% reduction in size over conventional electromagnetic relay (EMR) solutions. The fully ...

AMD's next-generation Zen 5-based Strix Halo APU arrives in FP11 package that's 60% bigger than Phoenix, same size as desktop Intel LGA1700 socket.

Benchmark of Substrate technology for AiP. Detailed numbers of each category can be found in IDTechEx’s report. Source: IDTechEx – “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, ...