Sensors Converge 2025 showcased technological advances in sensing solutions for automotive, industrial, and smart home applications.

The Trump administration is readying a package of executive actions aimed at boosting energy supply, four sources said.

An F suffix, for example, means it needs discrete graphics, and a UL suffix signifies that the chip is power efficient and comes in a Land Grid Array (LGA) package.

Accurate characterization of package electrical behavior is critical to be able to achieve optimal performance and cost targets. This paper deals with an accurate modeling methodology to simulate DC ...

Flip chip ball grid array (FC-BGA) packages are preferred in high-performance computing and advanced packages because of their superior signal integrity, high input/output density, good thermal ...

Kicad-3d-packages-footprints During EDA workflow rarely I have need to model parts that I can't find on the web. To share 3d packages & footprints for Kicad suite chain I had created this repository.

greenfootprint is a lightweight Python tool that estimates the energy consumption and carbon footprint of any Python script. It helps developers measure the environmental impact of their code in terms ...