"The Flip Chip Pin Grid Array (FC-PGA) package is used on Pentium III processors, while Plastic Pin Grid Array (PPGA) packaging is used in Celerons," begins McMillan. He points out that this does ...

March 14 (Reuters) - TOPPAN Holdings Inc: * TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA) SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN END ...

The optical I/O is based on an optoelectronic flip-chip pin grid array (FCPGA) package, and the key components of the hybrid package are gallium arsenide VCSELs, p-type intrinsic n-type doped ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

The global Ball Grid Array (BGA ... It is used in the automotive sector for high-pin-count equipment as well as in combination with Flip chip (FC) technology to boost direct and short device ...

This includes two-times the board-level reliability of a standard FC-PBGA (Flip Chip plastic ball grid array) or FC ceramic BGA, as well as full signal wiring on both sides of the core, according to ...

and the ability to use perimeter rather than area array pads. “It hasn't been economically feasible to use flip-chip technology for devices having pin counts below 1,000,” Karnezos said. “You need a ...