The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

Meanwhile, MediaTek has reportedly secured significant packaging capacity, likely for the new processors, using FCBGA (Flip Chip Ball Grid Array) technology, which enables the CPU and GPU to be ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Then came organic flip-chip ball-grid arrays (BGAs). The lead-free and halogen-free solutions came in the early 2000s. Now Intel is trying to pack more chips in a single package.

Ball Grid Array (BGA) is a form of surface-mount packaging that makes the electrical connection between the IC and the PCB using a grid of solder balls. On the backside of the BGA package is a network ...

The Polymer Stud Grid Array (PSGA) package is a new and unique type of area array chip scale package that shows significant advantages over conventional package configurations by virtue of its high ...