News
Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies ...
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators - IEEE Xplore
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback