AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

Compared with the reported broadband absorbers using lumped resistors, our proposed absorber exhibits excellent characteristics in terms of compact and simple structure, high relative absorption ...

Lorenzo Bertelli, son of Prada's owners, acknowledged sandal design's Indian heritage.