SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive ...

Amid intensifying US-China tensions and persistent uncertainty in global demand, major memory chipmakers are moving to phase out DDR4 DRAM, triggering a rapid spike in prices as supply constraints ...

The companies plan to develop a structure for stacked DRAM chips that uses a different wiring structure than current advanced high-bandwidth memory, slashing power consumption by roughly half.

So while 3D X-DRAM may indeed deliver bigger, faster memory by 2026, it’s unlikely these 512GB modules will be available to consumers anytime soon. More likely, such capacity and speed will be ...

July 31, 2014 -- IC Insights’ just-released Mid-Year Update to the 2014 McClean Report provides a detailed look at the DRAM and NAND flash memory market trends and forecasts through 2018. The new ...

Recent technological advances have opened new exciting possibilities for the development of cutting-edge quantum devices, including quantum random access memory (QRAM) systems. These are memory ...

Micron Technology has rolled out what it claims is the industry’s fastest low-power double data rate 5X (LPDDR5X) memory with a speed grade at 10.7 gigabits per second (Gbps) designed to accelerate ...

We propose a novel mini-rank architecture for DDRx memories to reduce memory power consumption by breaking each DRAM rank into multiple narrow mini-ranks and activating fewer devices for each request.

SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence memory chips with plans to introduce vertically stacked 3D HBM from its ...